On wafer device modeling parameter extraction service
Reliability Modeling Service
Early failures / Randon failures / Aging,Wear-out failures
On-Board Devices Modeling
This is a simulation model creation service for all electronic components mounted on a printed circuit board. You can easily obtain high-precision and High-performance simulation models.
In addition to SPICE model creation, we provide comprehensive services such as extraction TEG design support tailored to your request and consulting on selecting the optimal device model.
We offer a model creation service for characteristic degeneracy simulation for MOSFET characteristic degeneracy caused by HCI (Hot Carrier Injection) and BTI (Bias Temperature Instability).